Micron Technology (Nasdaq: MU) is now shipping its high-capacity, monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory, offering speeds up to 5,600 MT/s on leading server platforms. Built on Micron’s innovative 1β (1-beta) technology, this advanced memory module would boast significant improvement in bit density, enhanced energy efficiency, as well as reduced latency.

Extensive collaboration with industry partners has led to widespread adoption of these modules, particularly in high-volume server CPUs. Designed to meet the demands of data centers for high-performance applications like artificial intelligence (AI), machine learning (ML), high-performance computing (HPC), and in-memory databases (IMDBs), Micron’s 128GB DDR5 RDIMM memory is supported by an extensive ecosystem including AMD, Hewlett Packard Enterprise (HPE), Intel, and Supermicro.

Praveen Vaidyanathan, Vice President and General Manager of Micron’s Compute Products Group, highlighted the significance of this milestone. He said, “Micron continues to lead the market in providing high-capacity RDIMMs that have been qualified on all the major CPU platforms to our customers.” He emphasized that AI servers now utilize Micron‘s 24GB 8-high HBM3E for GPU-attached memory and 128GB RDIMMs for CPU-attached memory, providing the capacity, bandwidth, and power efficiency needed for memory-intensive workloads.

AMD, HPE, Intel, Supermicro

Micron’s advancements are welcomed by leading industry partners. Dan McNamara, AMD’s Senior Vice President and General Manager of the Server Business Unit, noted the collaboration’s impact on data center infrastructure, saying that AMD EPYC CPU-powered servers can now leverage Micron’s high-capacity DDR5 memory to deliver the necessary performance and efficiency for modern data centers.

HPE’s Senior Vice President and General Manager of Compute, Krista Satterthwaite, emphasized the critical role of advanced memory in supporting AI workloads. She reaffirmed HPE’s commitment to delivering high-performing, energy-efficient solutions, including monolithic, high-density DRAM, through collaboration with Micron.

Intel’s Vice President of Memory and IO Technologies, Dr. Dimitrios Ziakas, praised Micron’s 128GB DDR5 RDIMM memory as the first 32Gb monolithic DRAM-based high-capacity DIMM to achieve Intel platform compatibility qualification. He stressed the significance of these modules in boosting performance, capacity, and power efficiency for Intel Xeon processor-based systems, crucial for AI and server customers.

Supermicro’s Senior Vice President of Business Development, Wally Liaw, expressed excitement about the collaboration with Micron, emphasizing the potential of the 32Gb monolithic DRAM-based 128GB memory in Supermicro’s GPU SuperServers. Liaw highlighted the advantages of increased memory footprint, performance, and efficiency in AI infrastructure.

Micron’s 128GB DDR5 RDIMM memory is available directly from Micron and will be accessible through select global distributors and resellers in June 2024. The company’s comprehensive data center memory portfolio includes various options across DDR5 RDIMMs, MCRDIMMs, MRDIMMs, CXL, and LPDDR5x, providing customers with optimized solutions for AI and high-performance computing (HPC) applications that meet specific requirements for bandwidth, capacity, and power optimization.